Package Design Engineer

About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

What You Can Expect

• Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC/PIC designers to develop a portfolio of packages that meets a huge range of performance design points, while optimizing re-use in other Marvell products.
• Scope all aspects of package substrate design feasibility for multi-chip SiP packaging.
• Lead all aspects of package layout based on I/O, SI-PI and form factor requirements, including routing, design for reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing.
• Meet specifications for high-speed interfaces such as HBM, DDR, PCIe and 56G/112G SerDes.
• Netlist management for heterogeneous chiplet assemblies using latest EDA solutions.
• Supporting activities related to production and assembly of IC packages with substrate suppliers and OSATs.
• Actively participate in qualification of package and board level assembly with sensitivity to physics of failures for high thermo-mechanical reliability, driving appropriate test vehicle definition and design.
• Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Marvell

What We're Looking For

• BS/MS/PhD in EE/ECE/MSE/ME/ChemE or related disciplines.
• 5-10 years of experience in Semiconductor Packaging Design.
• Extensive experience working with advanced packaging design tools such as Cadence APD.
• Familiarity with MCAD tools such as AutoCAD.
• Familiarity with high density/high performance interconnects in various 2.5D/3D packaging technologies including InFO, CoWoS, FoCoS and EMIB.
• Good understanding of cross-functional packaging areas: Si floor plan, package, board layout and architecture, design rules, BOM, enabling material/process technologies, thermal, mechanical, Signal/Power Integrity, design for manufacturing, assembly, reliability, and cost.
• Familiarity with photonics packaging is a plus but not necessary.
• Proven track record of working with substrate vendors to meet design for manufacturing, yield, and reliability.
• Proven track record of engagement with OSATs to meet assembly requirements and drive new developments to meet new product requirements.
• Familiarity with High Speed Signaling best practices, Signal and Power integrity requirements.
• Strong analytical, problem-solving, cross-functional collaboration, project management, and technical presentation skills.

PREFERRED QUALIFICATIONS

• Expertise in heterogeneous integration, fan-out packaging, chiplet architectures - co-design, layout, and netlist management.
• Knowledge of Signal and Power Integrity.
• Experience in substrate vendor and OSAT assembly engagement to meet manufacturing and assembly requirements.

Expected Base Pay Range (USD)

The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.

Interview Integrity

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.