Principal Process Integration Engineer

The Principal Process Integration Engineer is responsible for ensuring the quality, reliability, and yield of InP-based Photonic Integrated Circuit (PIC) products. This role plays a key part in ramping high-volume production and works cross-functionally to troubleshoot and optimize wafer fabrication processes, resolve yield issues, and support next-generation PIC platform development.

* Own wafer quality and yield using deep knowledge of fab processes, device physics, and test/reliability data

* Analyze process deviations and test failures to identify root causes and implement corrective actions

* Establish, maintain, and monitor inline fab process specifications and capability (CPK)

* Drive yield improvement initiatives from concept through qualification and production release

* Define design rules and develop test structures for effective process control

* Support technology development, transfer, and manufacturing ramp for next-generation PIC platforms

* Partner with Process Engineering to improve process stability and capability

* Collaborate with Operations to improve throughput and reduce cycle time

* MS or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related field

* 10+ years of experience in semiconductor wafer fabrication

* Hands-on experience with III-V processes, including epitaxy, wet and dry etching, photolithography, and metal deposition

* Strong understanding of semiconductor processes and device physics

* Proven analytical and problem-solving skills with proficiency in data analysis tools (e.g., JMP, Python)

* Experience with SPC, DOE, and yield optimization methodologies

* Excellent communication skills with the ability to present technical work to diverse stakeholders