New

Early-Career Failure Analysis (FA) and Destructive Physical Analysis (DPA) Techn

Assurance Technology Corporation (ATC)
48,000 - 60,000 yr.
United States, Massachusetts, Chelmsford
303 Littleton Road (Show on map)
Sep 28, 2026
ATC is looking for an early-career Failure Analysis and Destructive Physical Analysis technician to join our FA and DPA team supporting ATC's design and development of space systems, payloads, and equipment. You will become familiar with electronic part construction (passive and active) and military standards, and will perform Failure Analysis and Destructive Physical Analysis on electronic parts using the latest in parts-analysis systems and equipment. You will also work as a team member with program managers, quality assurance, parts engineering, manufacturing, and test personnel to resolve anomalies and failures, using DPA and real-time X-ray techniques to verify the quality of the parts and subassemblies going into space. You will have the satisfaction of knowing your work contributes directly to ATC-developed, high-value, operational space systems. You don't need years of industry experience to apply - we're looking for someone with a solid technical foundation, curiosity, and a willingness to learn. You'll get direct mentorship from senior engineers and technicians while contributing to the success of real space systems, payloads, and units. Basic Qualifications High school diploma or equivalent required; Associate's or Bachelor's degree in a technical field (electronics, materials science, engineering technology) preferred Comfortable working with small, precision components under a microscope for extended periods Strong attention to detail and clear written documentation skills (for analysis reports) Ability to safely handle chemicals and operate lab/inspection equipment following documented safety procedures Preferred Qualifications Experience using some of the following equipment and techniques is desired, but we'll be happy to help you build these skills on the job. Part deprocessing (delidding, chemical decapsulation, metallurgical cross-sectioning) Bond pull and die shear Parts inspection using optical microscopes Scanning electron microscopes Photographic documentation (micro and macro) Real-time X-ray Generate Analysis Reports Eligibility Requirements This position requires U.S. citizenship. Candidates must also work well in a team environment, communicate and interface effectively with cross-functional stakeholders, and pass an annual vision screening (needed for microscope-based inspection work).